Lab Wizard  8.0 Plating Line Analysis / Manager Demo Software  

Download Demo 15 MB ZIP file

System Requirements:
  1. IBM compatible PC with at least 800 MHz CPU
  2. Operating Systems: Window 98*, Windows 2000, Windows XP
  3. Ram (minimum): Win98 – 64 Meg, Win 2000 – 256 Meg, Win XP – 256 Meg

  4. VGA monitor with video resolution of 1024 X 768, 17" monitor recommended.

It is recommended that the computer be dedicated to Lab Wizard and run 24 hours a day.

* Requires decom and mdac version 2.5 upgrades

To change the video resolution:
  1. Right mouse click on the desktop area
  2. Select properties
  3. Click on the settings tab
  4. Change the desktop area to read 1024 by 768 pixels
  5. Make sure the font size reads "small font"
  6. Click on the OK button

Typical Plating Line Processes used with Lab Wizard plating line software are  Automated Plating, Brown Oxide, Electroless Copper, Manual Plating, Pumice Pre-Clean, S.E.S. Line.

Typical plating line stations used with Lab Wizard Plating Line Software are 1% Sulfuric, 10% Solderon, 10% Sulfuric, 10% Sulfuric, 748 Microetch, Ammonia Etcher, Copper, Bath "A", Copper, Bath "B", Day Tank, Microetch, Oxide, Pattern  Prep, PC-960 Cleaner, Post-Dip, Pre-dip, Resist Stripper, Solder Stripper.

Typical plating line components used with Lab Wizard plating line software are 426 Surface-tech Stripper, 484 "B", 484"B", 50% HCl (High Purity), 783 Envirostrip, Besbon E-339, Chlorides, Circuposit PB Converter, Copper, Cuposit Z, Etch Rate, Hydrogen Peroxide, Pattern Prep 24 Make-Up Salt, PC Solderon ACID, PC-960, pH, Preposit 748, Preposit Etch 748, Specific Gravity, Sulfuric Acid, Sulfuric Acid (PC Grade) .

 

    E-mail  B.P.S. for pricing

 Download Manual