Lab Wizard Plating Line Lab Analysis / Manager Software  8.0 Is Here

Includes plating line Statistical Process Control (SPC) six sigma and Cpk process capability chart analysis,

 plating line SQL sequel server database connectivity, plating line bath historical reporting,

 remote viewing of plating line activities, and plating line chemical inventory management,

 plating line PM preventative maintenance on filters and equipment.

 

    E-mail  B.P.S.

Download Manual

Download Demo

FEATURES & SCREEN SHOTs

Feature Overview More Info
Simple to use / Intuitive Graphical User Interface, allows lab technicians to easily see upcoming adds to make to chemical baths and when a chemical tank / bath needs to be analyzed or dumped.

 plating line analysis management software lab wizard

Process History: The process history screen displays a chart of the product throughput for the process highlighted in the list box. The period of time shown in the chart is determined by the setting of the start date and the end date (default is the last 30 days). Choose the process and time interval then click on the “Execute Query” button and the appropriate data is graphed. The “Total Amount Processed Through Line” window indicates the total amount with units for the time period selected. To view the throughput for other processes, click on the process in the list box. Clicking on the “View Daily Analysis by Process” will show details associated with a process for a given day (See section “Printing and Reports for details). lw-ss-ph-chart.gif (51880 bytes)

lab wizard Plating line process history screen shot

 

This Lab Wizard screen displays the out of spec causes used for all plating line  processes. The time interval is chosen by the month or months. The out of spec causes are listed by "% occurrence" or "frequency".

 

lab wizard plating line out of spec cause pareto
Preventative maintenance for plating line equipment.   lw-ss-pm.gif (43318 bytes)
Lab Wizard Plating Line Setup Screen

The setup screen requires a level 5 password login to enable the menu for access to this screen. The setup screen shows the details of how each process is structured. Choosing a process, station, or component in the list boxes, displays the setup values for each. Nothing can be changed from this screen. To add, modify, or delete a process, you must use the “Process Options” dropdown menu. To add, modify, or delete a station, you must use the “Station Options” drop down menu. To add, modify, or delete a component, you must use the “Component Options” drop down menu. All other program attributes are accessed thru the menus at top of the screen. The yellow drop down menus display the listed values in the text box associated with the control.

lab wizard plating line setup screen

 

Plating line station - component setup allows you to enter in spec limits, analysis formula, plating line chemical analysis instructions, and statistical process control limits.  You have the option to make your limits self calculating or fixed using six sigma.   plating line analysis setup screen for lab wizard
Plating line lab analysis is made easy with  Statistical Process Control Charts six sigma.

Labwiz  chemical bath plating line analysis SPC Cpk plot tools

Plating line Cpk process capability Calculation tools including distribution graphing (optimal is > 1.3 Cpk)
Point and click historical reporting which includes plating line out of spec pareto histogram items and corrective actions.

Easy history reports, lab wizard bath chemical plating line tank management

Add on inventory package that makes managing your plating line chemicals  easy,  includes Purchase Order tools for ordering more chemicals for your plating line tanks and baths. .
Performs complex plating line calculations for your technicians so they can just put one parameter into the formula and Lab Wizard will spit out amount for the tech to add. Or it can prompt the technician to dump the tank and make a new bath.

Typical Plating Line Processes used with Lab Wizard plating line software are   Brown Oxide, Electroless Copper,  Pumice Pre-Clean, S.E.S. Line, hot air level.

Typical plating line stations used with Lab Wizard Plating Line Software are 1% Sulfuric, 10% Solderon, 10% Sulfuric, 10% Sulfuric, 748 Micro etch, Ammonia Etcher, Copper, Bath "A", Copper, Bath "B", Day Tank, Microetch, Oxide, Pattern  Prep, PC-960 Cleaner, Post-Dip, Pre-dip, Resist Stripper, Solder Stripper.

Typical plating line components used with Lab Wizard plating line software are 426 Surface-tech Stripper, 484 "B", 484"B", 50% HCl (High Purity), 783 Envirostrip, Besbon E-339, Chlorides, Circuposit PB Converter, Copper, Cuposit Z, Etch Rate, Hydrogen Peroxide, Pattern Prep 24 Make-Up Salt, PC Solderon ACID, PC-960, pH, Preposit 748, Preposit Etch 748, Specific Gravity, Sulfuric Acid, Sulfuric Acid (PC Grade) .

    E-mail  B.P.S.

Download Manual

Download Demo