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FEATURES & SCREEN SHOTs
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Typical Plating Line Processes used with Lab Wizard plating line software are Brown Oxide, Electroless Copper, Pumice Pre-Clean, S.E.S. Line, hot air level. Typical plating line stations used with Lab Wizard Plating Line Software are 1% Sulfuric, 10% Solderon, 10% Sulfuric, 10% Sulfuric, 748 Micro etch, Ammonia Etcher, Copper, Bath "A", Copper, Bath "B", Day Tank, Microetch, Oxide, Pattern Prep, PC-960 Cleaner, Post-Dip, Pre-dip, Resist Stripper, Solder Stripper. Typical plating line components used with Lab Wizard
plating line software are 426 Surface-tech Stripper, 484 "B",
484"B", 50% HCl (High Purity), 783 Envirostrip, Besbon E-339,
Chlorides, Circuposit PB Converter, Copper, Cuposit Z, Etch Rate,
Hydrogen Peroxide, Pattern Prep 24 Make-Up Salt, PC Solderon ACID,
PC-960, pH, Preposit 748, Preposit Etch 748, Specific Gravity, Sulfuric
Acid, Sulfuric Acid (PC Grade) |
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E-mail B.P.S. |
Download Manual |